Sintering technology is a new joining method using microscale sintered particles. Using temperature, pressure and time, a material bond is formed between the parts to be joined in the low temperature range (200 °C to 260 °C). The sintered particles (micron range) are processed with the use of solvents to form a sintering paste which, similar to reflow technology, is printed or dispersed onto the substrate (organic circuit boards, inorganic substrates or leadframes). Solder molded parts are also common and possible here. Sintering technology is used to create interconnects between bare chips and/or passive components.
Sintering technology is mainly used in the manufacturing of power modules, but also in lighting technology, in the automotive industry, in the manufacturing of wind turbines or in industrial drive technology.