In the process chamber of the soldering systems, a plasma atmosphere is used to significantly improve the wettability of the components and substrate materials. Passive layers on the connections, which hinder or preclude wetting with liquid solder, can also be reduced.

With the aid of plasma soldering, a significant improvement in solder bonding can be achieved, leading to an increase in process yield and reliability. The use of plasma also reduces thermal stresses on the components, which contributes to an improvement in life time of the components.