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Loetversuch
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Diagramm Loetprozess

The main benefits of Vacuum Soldering during soft-soldering-process up to 450 ° C through the controlled use of gases during assembly process are:

 

- Bonding surfaces free from oxide and cavities, ranging from chip to ceramic substrate

- Integrated or separate implementation of cleaning and scaling processes

- No or only very minor amounts of residual contamination on the product

- No degassing processes on the product

- Different pressure areas can be created inside of the sealed chambers

- Sealing of chambers with a previously defined gas atmosphere

- Assembly in high vacuum

- Integration of drying and degassing processes

- Possibility of a further miniaturization

- The better derivation of heat loss

- A considerably increased yield in production

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