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Company History

 

2016

Move into the new production and office buildings in the Melli-Beese-Street, Berlin, at the former airport Johannisthal

 

2014

Participation in the project “MetamoFAB“ (Industry 4.0), government-sponsored by the Ministry for Education and Research

 

2013

Development of the automated inline vacuum soldering system VS 320i for mass production

 

2012

Delivery of first products to the Russian distribution company Avanteh Ltd.

Cooperation with Avanteh around distribution in Russia, expansion of the Russian distribution network

Number of employees exceeds ten

 

2011

Joint research projects with the Institutes of Fraunhofer Gesellschaft, IZM Berlin, IISB Nuremberg, IAF Freiburg, and the University of Rostock

 

2010

Technological cooperation in “wire-bond technology“ with Hesse-Mechatronics GmbH and in “Die-bond technology“ with Häcker Automation GmbH

Development of the vacuum soldering system VS 320 with options of hydrogen and plasma cleaning

 

2009

Formation of the company budatec GmbH by Alexander Dahlbüdding and Dirk Buße

Development and construction of the first vaccum soldering system VS 160

Delivery of first products to well-known clients, e.g. Heraeus Holding GmbH and Keller AG in Switzerland

 

2003-2009

Acquistion of Teca Technologieorientierte Automation GmbH by centrotherm thermal solutions GmbH & Co. KG

 

1991-2003

Based on the Institute for Communications Engineering formed the company Teca Technologieorientierte Automation GmbH with a focus on development and construction of vacuum soldering systems like the MCM (Multichip-automatic assembly machine) as well as automation systems for the semiconductor industry (feeding systems for wire bonders). This team became later the founding team of the budatec GmbH

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